ATS028028018-SF-9Q

Advanced Thermal Solutions
984-ATS028028018SF9Q
ATS028028018-SF-9Q

Tillverk:

Beskrivning:
Kylflänsar BGA Heat Sink, Straight Fin, No TIM, Black Anodized, 28x28x18mm (LxWxH)

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Tillgänglighet

Lager:
Ej på lager
Fabrikens ledtid:
8 Veckor Uppskattad tillverkningstid i fabriken.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
71,50 kr 71,50 kr
67,54 kr 675,40 kr
63,80 kr 1 276,00 kr
59,95 kr 2 997,50 kr
56,32 kr 5 632,00 kr
53,02 kr 10 604,00 kr
51,15 kr 25 575,00 kr
49,28 kr 49 280,00 kr

Produktattribut Attributvärde Välj attribut
Advanced Thermal Solutions
Produktkategori: Kylflänsar
RoHS-direktivet:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
4.82 C/W
28 mm
28 mm
18 mm
Märke: Advanced Thermal Solutions
Färg: Black
Monteringsland: Not Available
Distributionsland: Not Available
Ursprungsland: CN
Förpackning: Bulk
Produkttyp: Heat Sinks
Serie: BGA High Aspect Ratio
Fabriksförpackningskvantitet: 100
Underkategori: Heat Sinks
Handelsnamn: Value-Line Platform
Typ: Component
Hittade produkter:
Markera minst en kryssruta för att visa liknande produkter
Markera minst en kryssruta ovan för att visa liknande produkter i denna kategori.
Attribut som valts: 0

Denna funktion kräver att Javascript är aktiverat.

USHTS:
7616995100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.