CQB-AU100-23um

Chip Quik
910-CQB-AU100-23UM
CQB-AU100-23um

Tillverk:

Beskrivning:
Lod Gold Bonding Wire (Au100) Gold 23um (0.9mil) (Solid Core)

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Nytt från denna tillverkare.

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Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
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Est. Pris:
Denna produkt levereras UTAN KOSTNAD

Prissättning (SEK)

Antal Enhetspris
Ext. pris
6.595,49 kr 6.595,49 kr

Produktattribut Attributvärde Välj attribut
Chip Quik
Produktkategori: Lod
RoHS-direktivet:  
Solder Wire
23 um
Spool
Märke: Chip Quik
Monteringsland: Not Available
Distributionsland: Not Available
Ursprungsland: CN
Produkttyp: Solder
Serie: CQB
Fabriksförpackningskvantitet: 1
Underkategori: Solder & Equipment
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Attribut som valts: 0

TARIC:
8311900000
CAHTS:
8311900000
USHTS:
8311900000
JPHTS:
831190000
BRHTS:
83119000
ECCN:
EAR99

CQB Gold Bonding Wires

Chip Quik CQB Gold Bonding Wires are made of high-purity gold >99.99% and are designed specifically for wire bonding. These bonding wires are stored in a dry, non-corrosive environment and offer excellent electrical conductivity, stability, and resistance to corrosion. The CQB wires are available in 23µm and 25µm diameters. These wires connect electrical components in industries and electrically connect microchip dies to the terminals of a chip package or directly to a substrate. The CQB bonding wires are RoHS 3 compliant, REACH compliant, and conform to J-STD-006C standard. These wires are used by Integrated Circuit (IC) packaging shops, research labs, and advanced manufacturing facilities. The CQB gold bonding wires are ideal for electronics, aerospace, and medicine.