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627-11W1224-1N1

Name: EDAC 627-11W1224-1N1
Brand: EDAC
SKU: 587-627-11W1224-1N1
Price: 70.95 SEK
Availability: InStock

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Mouser nr:

587-627-11W1224-1N1

Tillverk: Nr.:

627-11W1224-1N1

Tillverk:

EDAC

Beskrivning:

D-sub-mixade kontakt-anslutare 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, PCB tails, nickel plated shell

Datablad:

627-11W1224-1N1 Datablad

ECAD-modell:

Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Mer information

Lär dig mer om EDAC 627-11W1224-1N1

På lager: 250

Lager:: 250 Kan skickas omedelbart

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Ange kvantitet:

Minst: 1 Flera: 1

Enhetspris:

-,-- kr

Ext. pris:

-,-- kr

Est. Pris:

Prissättning (SEK)

Antal	Enhetspris	Ext. pris
	70,95 kr	70,95 kr
	64,24 kr	642,40 kr
	60,61 kr	1 515,25 kr
	59,18 kr	2 959,00 kr
	56,21 kr	5 621,00 kr
	50,38 kr	12 595,00 kr
	47,30 kr	23 650,00 kr
	41,47 kr	41 470,00 kr
	39,38 kr	98 450,00 kr

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Produktattribut	Attributvärde	Välj attribut
Tillverkare:	EDAC
Produktkategori:	D-sub-mixade kontakt-anslutare
REACH - SVHC:
Kontaktarrangemang:	11W1
Antal positioner:	11 Position
Monteringsstil:	Through Hole
Monteringsvinkel:	Vertical
Termineringsstil:	Solder Cup
Märke:	EDAC
Kontaktmaterial:	Copper
Kontaktplätering:	Gold
Monteringsland:	Not Available
Distributionsland:	Not Available
Ursprungsland:	TW
Märkström:	10 A
Filtrerad:	Unfiltered
Kön:	Male
Isolering:	Insulated
Isoleringsmaterial:	Thermoplastic Polyester
Maximal drifttemperatur:	+ 125 C
Minsta drifttemperatur:	- 55 C
Produkttyp:	Mixed Contact D-Sub Connectors
Serie:	627
Skalmaterial:	Steel
Skalplätering:	Nickel
Fabriksförpackningskvantitet:	1
Underkategori:	D-Sub Connectors
Märkspänning:	125 V

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Attribut som valts: 0

Filtrera dokument:

TARIC:: 8536693000
USHTS:: 8536694040
ECCN:: EAR99

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.