HDTM-3-04-2-S-VT-0-4

Samtec
200-HDTM-3042SVT04
HDTM-3-04-2-S-VT-0-4

Tillverk:

Beskrivning:
Höghastighets/modulära kontakter XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.

Tillgänglighet

Lager:
Ej på lager
Fabrikens ledtid:
3 Veckor Uppskattad tillverkningstid i fabriken.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
69,63 kr 69,63 kr
60,28 kr 1 507,00 kr
51,04 kr 3 062,40 kr
37,07 kr 4 448,40 kr
34,32 kr 18 532,80 kr

Produktattribut Attributvärde Välj attribut
Samtec
Produktkategori: Höghastighets/modulära kontakter
RoHS-direktivet:  
Headers
4 Row
1.8 mm
Solder Pin
Gold
HDTM
Tray
Märke: Samtec
Kontaktmaterial: Copper Alloy
Monteringsland: Not Available
Distributionsland: Not Available
Ursprungsland: CN
Höljfärg: Black
Höljets material: Liquid Crystal Polymer (LCP)
Maximal drifttemperatur: + 105 C
Minsta drifttemperatur: - 40 C
Monteringsvinkel: Vertical
Produkttyp: High Speed / Modular Connectors
Fabriksförpackningskvantitet: 60
Underkategori: Backplane Connectors
Handelsnamn: XCede
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Attribut som valts: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.