GPVOUS-0.060-00-0816

Bergquist Company
951-GPVOUS-060-00
GPVOUS-0.060-00-0816

Tillverk:

Beskrivning:
Termiska gränssnittsprodukter GAP PAD, 8" x 16" Sheet, 0.060" Thickness TGP1000VOUS/VO Ultra Soft, IDH 2191191

Datablad:
ECAD-modell:
Ladda ned den kostnadsfria Libary Loader för att omvandla denna fil för ditt ECAD-verktyg. Läs mer om ECAD-modellen.
Mer information
Lär dig mer om Bergquist Company GPVOUS-0.060-00-0816

På lager: 752

Lager:
752 Kan skickas omedelbart
Fabrikens ledtid:
4 Veckor Uppskattad tillverkningstid i fabriken för kvantiteter som är större än vad som visas.
Minst: 1   Flera: 1
Enhetspris:
-,-- kr
Ext. pris:
-,-- kr
Est. Pris:

Prissättning (SEK)

Antal Enhetspris
Ext. pris
293,04 kr 293,04 kr
250,03 kr 2.500,30 kr
240,90 kr 6.022,50 kr
239,25 kr 11.962,50 kr
234,52 kr 23.452,00 kr
228,47 kr 57.117,50 kr
228,36 kr 114.180,00 kr

Produktattribut Attributvärde Välj attribut
Bergquist Company
Produktkategori: Termiska gränssnittsprodukter
RoHS-direktivet:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone Elastomer
1 W/m-K
6 kVAC
Pink
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.524 mm
8 psi
UL 94 V-0
VO Ultra Soft / TGP 1000VOUS
Märke: Bergquist Company
Monteringsland: Not Available
Distributionsland: Not Available
Ursprungsland: US
Designad för: Telecommunications, Computers and Peripherals, Power Conversion, Semiconductors
Produkttyp: Thermal Interface Products
Storlek: 8 in x 16 in
Fabriksförpackningskvantitet: 1
Underkategori: Thermal Management
Handelsnamn: GAP PAD
Del # Alias: L8INW16INH0.06 2191191
Enhetens vikt: 225,788 g
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Attribut som valts: 0

TARIC:
8541900000
CNHTS:
3824999999
CAHTS:
8541900000
USHTS:
3919905060
JPHTS:
8542900006
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

TGP 1000VOUS Ultra Conformable GAP PAD®

Bergquist TGP 1000VOUS Ultra Conformable GAP PAD® filling material provides ultra-conformable gel-like material with thermal conductivity of 1.0W/m-K. This filling material is ultra-soft and offers excellent low-stress vibration dampening and shock absorbency for applications requiring a minimum amount of pressure on components. Bergquist GAP PAD TGP 1000VOUS Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

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