TE Connectivity’s (TE) Octal Small Form Factor Pluggable (OSFP) Connectors, Cages, and Cable Assemblies meet the needs of next-generation data centers by supporting aggregate data rates of 200 Gbps, and up to 400 Gbps. The products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. The plugs utilize integrated thermal heatsink technology to offer superior thermal performance and the signal integrity needed to support 400G data rates. TE's OSFP products offer high port density and can fit up to 36 ports of an 8-lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps.
Features
Designed for 28G NRZ and 56G PAM-4 protocols
Up to 15W thermal loads with low airflow
Fits up to 36 ports in a 1RU switch form factor
200Gbps to 400Gbps data rates
Superior thermal and signal integrity performance
High port density
Applications
Switches
Servers
Routers
Storage Equipment
Specifications
Connectors
8-lane high density connector, footprint and mating interface per OSFP MSA spec
0.6mm pitch, 60 contacts total
Cost-effective wafer design with 2 rows of contacts
Belly-to-belly capable via in-ground alignment for low PCB cost and noise
Proven to 56G PAM-4, with roadmap to 112G PAM-4
Cage Assemblies
1 x 1 and 1 x 4 cages to support both multi and single port applications
Stainless steel cage with tuned airflow venting supports module cooling and optimal system airflow
Traditional EMI containment at the bezel and port opening
